Technology of the Year

Ziptronix, Inc.

Description

Ziptronix was spun out from North Carolina’s Research Triangle Institute for the purpose of commercializing a revolutionary semiconductor bonding technology. Ziptronix is the first company to provide the semiconductor industry with a revolutionary adaptation of standard industry processes, which enables MEMS assembly, packaging, and testing to be cost-effectively integrated into volume production at the foundry.

Reasons for winning the award

Ziptronix’s ZiROC technology is a first for the industry because it bonds semiconductor wafers together covalently at room temperatures and without adhesives. Using this technology, Ziptronix enables its customers to leverage existing intellectual property, functions and process technology from the entire integrated circuit value chain. Since 2002, demand has skyrocketed for Ziptronix’s custom engineered substrates based on the company’s proprietary ZiROC bonding technology. In late May 2003, the company also completed $17.4 million in second-round financing, led by Grotech Capital Group and Intersouth Partners.

Quote

"I am honored to receive this award from CED on behalf of everyone at Ziptronix. Over the past year, our team pulled together and proved to the semiconductor industry that our technology is a true paradigm shift and tackles the skyrocketing costs of new product development. I would like to extend gratitude to the CED for all the support the organization affords that helped us in our efforts to expand and thrive." -- Doug Milner, President and CEO

History

Founded in October 2000, Ziptronix is a privately held company spun from the Research Triangle Institute to commercialize ten years of research and development leading to the fabrication of three-dimensional integrated circuits. The company received CED’s 2001 Spin Off of the Year Award.

Photo courtesy of BP Studios.

Home | Current Winners | Nomination Form

Categories | Past Winners | Register